PPS vs PEEK for Wet Process Tools: When to Switch for Cost
When Can PPS Replace PEEK for Cost in Wet Process Tools?
In select semiconductor wet process applications, semiconductor-grade PPS can deliver comparable chemical resistance and dimensional stability at a lower material cost than PEEK—provided the application does not require PEEK’s higher thermal performance.
Context: Wet Process Component Requirements
Wet process components typically require:
- High chemical resistance
- Dimensional stability
- Low outgassing
- Mechanical strength and stiffness
- Thermal performance appropriate to the tool environment
PEEK is an outstanding performer overall, especially for elevated temperature service—but that performance comes with a higher material cost. Where peak thermal demands are not required, semiconductor-grade PPS may provide a more economical choice while meeting the application’s chemical and mechanical needs.
Quick Answer
PPS can often replace PEEK in wet process components that:
- Operate below the higher heat deflection range typically achieved by PEEK
- Prioritize chemical resistance, dimensional stability, and low outgassing
- Require cost optimization without sacrificing critical performance
PPS vs. PEEK — At-a-Glance Comparisons
| Critical Property | Semiconductor-Grade PPS | Industry-Standard PEEK |
|---|---|---|
| Tensile Modulus (psi) | ~500,000 | ~630,000 |
| Flexural Modulus (psi) | ~575,000 | ~600,000 |
| Coefficient of Linear Thermal Expansion (CLTE) | ~2.8 | ~2.6 |
| Moisture Absorption @ 24 hrs | Low | Low |
| Heat Deflection Temp @ 264 psi (°F) | ~250 | ~320 |
| Relative Cost | $ | $$ |
Outgassing Properties (typical)
| Material | %TML | %CVCM | %WVR |
|---|---|---|---|
| PEEK | 0.26 | 0 | 0.12 |
| Semicon-grade PPS | 0.04 | 0 | 0 |
Chemical Resistance (representative)
- Acids/Bases: Both materials show strong resistance across many wet process chemistries; verify by specific concentration and temperature.
- Solvents: PEEK generally performs well against many organics; PPS also offers broad resistance in semiconductor environments.
- Halogens/Salts/Alcohols/Amines: Application-specific validation still required.
Note: Always confirm against your exact chemistry, concentration, and operating temperature/time profile.
Selection Guidance
- Thermal load first: If your process demands higher heat deflection temperatures, PEEK may be required.
- If temperatures are moderate: Evaluate PPS for cost savings while maintaining chemical resistance, dimensional stability, and low outgassing.
- Validate in service: Confirm with real bath chemistry, exposure time, and mechanical loading.
Talk with Port Plastics
Choosing materials for wet process tool components benefits from a partner who understands both plastics and the semiconductor market. Contact your local Port Plastics sales office with your application details for material selection support.
FAQ: PPS vs. PEEK
- When is PPS a good substitute for PEEK?
- When operating temperatures are moderate and the application prioritizes chemical resistance, dimensional stability, low outgassing, and lower cost.
- What performance do I give up moving from PEEK to PPS?
- Mainly higher heat-deflection capability; verify mechanical margins and long-term thermal aging for your duty cycle.
- Is outgassing acceptable for semiconductor tools?
- Semiconductor-grade PPS and PEEK both exhibit low outgassing; review %TML/%CVCM/%WVR data for your cleanliness spec.
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