Chemical Mechanical Planarization - FLAT OUT AMAZING!
Chemical Mechanical Planarization, aka CPM is a critical process step in the building of IC devises on the wafer. The CMP process tool is used several times through the process to form the ultra flat surface needed to build the individual layers. Material removal is controlled with extreme precision through a combination of chemical reaction and mechanical abrasion technologies. To simplify the process does not do it justice as the tolerances from end to end on a 300mm wafer can be 2 angstroms, that's 2 one hundred millionths of a centimeter, or 10-10 meter! The CMP process selectively removes material by applying force to the backside of the wafer while suspended upside down against a rotating highly specialized pad that is saturated with a chemical slurry designed to remove the specific target chemical. A typical 300mm wafer can fit about 600 A13 bionic 7nm chips, thus precise polish is needed to ensure that each chip on the wafer has the same layer depth. Any over polish could damage the underlying critical feature of the chip. Chemical Mechanical Planarization is critical to maintain the structure of the IC devise layer after layer and is a critical technological gating process in dealing with the constant miniaturization of the transistor gate size. Simply put, its an amazing process!
Highly engineered plastics play a pivotal role in the CMP process. Plastics are used to secure the wafer and to selectively wear to help control the level and quality of the wafer wear. The materials used for the CMP process are manufactured under the strictest quality demands for cleanliness, consistency, low stress, and dimensional stability.
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