Todays Semiconductor manufacturing demands increasingly clean environments due to the reduction of the chip node size. This means that sources of particulation and contamination needs to be reduced in every facet of manufacturing. Electro Static Discharge management (ESD) thermoplastics have been used in semiconductor and electronics manufacturing for years, as it is critical to manage the bleed off of the pent up electricity.
Standard material technologies use additives such as Carbon Fiber to manage the movement of the charge. The issue with using Carbon Fiber is that high load is needed to successfully bleed of the charge. Carbon Nano Tube (CNT) technology uses micro size particles at a much lower loading to achieve the same effect in terms of energy dispersion thus delivering a cleaner overall product.
Ensinger offers TECAPEEK ELS nano, a PEEK based product that is extruded and that features a low load of CNT to achieve a conductive surface resistivity of 1QAE3 - 1QAE4! Since it is extruded it offers an economical alternative all while having the value of a near virgin polymer.
FOR MORE INFORMATION ON TECAPEEK ELS NANO OR ANY OTHER SEMICON PRODUCT CONTACT YOUR LOCAL PORT PLASTICS SALES OFFICE! OR VISIT US AT ESD PORTPLASTICS.COM/ESDMATERIALS.COM