Semiconductor Wet Process Plastics at the Component Level
Wet Process tools are not only prevalent throughout the IC chip making process, they consume the msot plastics due to the simple fact that they contain environments that are...wet! the combination of chemicals used to process and clean the wafers make plastics the best choice for designers as catastrophic corrosion and contamination would result from metal. That said, engineers and designers are face with decisions on selecting plastic materials to optimize longevity, performance, and purity. Component level [parts are different than structural plastics in that often they are critical parts defined by wafer direct contact or proximity, and thus need to be carefully selected and often maintain Copy Exact.
Component level parts typically are either wafer mobility related or comprise the chamber within which the processing or cleaning occurs. These are precision machines parts that are most often operating at temperature ranges near room temperature/ Materials are often chosen based on:
- Chemical and pH resistance
- Dimensional Stability and ability to hold tight tolerance
- Machine to fine features
Common materials for Wet Process components are (but not limited to)
- PEEK or PEEK derivatives
- PET or PBT
- Fluoropolymers such as: PTFE, PVDF, ECTFE and PFA
If you are looking to select or purchase materials for Wet Process Tool Components level parts look no further than Port Plastics, the leader in everything Semiconductor!
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