Blog

Oxygen Plasma for Vacuum Chambers

Key Criteria for Selecting Plastics in Oxygen Plasma EnvironmentsPlastic materials were prevalent in etch chambers in applications that were used to secure wafers such as retaining rings, secure compo …

Read more

When can PPS replace PEEK for cost?

Wet Process components have several requirements in common in terms of mechanical properties required, dimensional stability requirements, chemical resistance required and low outgassing. That said, …

Read more

The Role of "Copy Exactly" on Plastics ~ CE!

COPY EXACTLY aka: CE! is a process methodology developed by Intel to insure manufacturing technologies to produce chips in the laboratory setting are successfully transferred and scaled up in a high …

Read more

Thermal Expansion as it Relates to Plastic

 Can you take the Heat? - Understanding the Basics of Thermal ExpansionOne of the most critical properties that relate to plastic selection within the Semiconductor industry is the Coefficient of …

Read more