TECAPAI CM XP530 black-green is a compression molded polyamide-imide material that is modified with 30% glass fibre filler. Produced using Solvay Torlon® plastic polymer, TECAPAI
Semitron® MPR1000 is a new engineering material developed for Semiconductor applications and more specifically for use in vacuum chamber applications such as these found in
Semitron® CMP XL20 is the premium CMP material that was developed to give new tool designers and forward-thinking end users an opportunity to increase the
Duratron® T7130 PAI is 30% carbon fiber-reinforced. It offers exceptional stiffness, nonabrasive wear performance and the lowest coefficient of thermal expansion of all materials profiled
Compression Molded Duratron® T7530 PAI is 30% carbon fiber reinforced. It offers extreme stiffness in non-abrasive wear applications. The base resin is the same as
Duratron® PAI T5030 GF PAI Extruded is 30% glass-reinforced. It offers high rigidity, retention of stiffness, a low expansion rate and improved load carrying capabilities.
Semitron® ESd 520 HR is ideal for handling integrated circuits through the test handler environment.
This Duratron® PAI is primarily used for wear and friction parts.
Duratron® 4203 extruded PAI offers excellent compressive strength and the highest elongation of the Duratron grades.
This seal and bearing grade offers a very low coefficient of friction and good wear properties.
Duratron® 5530 is 30% glass reinforced, compression molded PAI.
This grade is commonly used for dies and patterns of formed metal parts or as thermal insulators and isolators.
Duratron® 4501 PAI is well suited for general purpose wear and friction parts.