Data Sheet
Semitron® MP 370 uses modified PEEK as a base resin offering higher heat for improved ability to machine clean fine features and improved toughness to resist breakage in use when compared to ceramic filled PEEK materials. Semitron® MP370 uses extrusion to manufacture ultra low stress consistent plate as compared to typical injection molded ceramic filled materials. Extruded material provides far better dimensional stability during machining allowing for finer features while maintaining tighter tolerances. Advantages of Semitron® MP 370 Ceramic Filled PEEK:
- Very low moisture absorption
- Finer, cleaner detail possible – excellent machinability
- Very high level of precision possible – low internal stresses
- Good value – ideal for specific application environments
Applications:
- IC test sockets for semiconductor manufacturing equipment
- Structural parts in electronics and telecom equipment
- Insulating blocks and fixtures in diagnostic equipment
