Chemical Mechanical Planarization (CMP)

Chemical Mechanical Planarization (CMP) is a process of polishing the layers of the wafer to near perfect flatness & smoothness upon which the layers of integrated circuitry are built.  On a 300mm wafer, transistor sizes of 10nm require a flatness of 2 angstroms across the wafer!  Critical to the process is the CMP retainer ring made from engineering plastics.  The CMP retainer rings function is to secure the wafer while controlling the rate and quality of the polish.  It is critical to match the right retainer ring material to the chemical slurry used and level of polish required.

Port Plastics is the market leader in distributing CMP near net engineering plastics to the North American market.  Port Plastics carries near net tube sizes in the most common materials for 150mm, 200mm and 300mm applications.

Relevant trends effecting CMP business

  • Defect free material due to miniaturization
  • Cost vs performance
  • Pin point use of materials to perform in specific slurries

Common Products Used for CMP Retainer Ring

  • PPS
  • PET
  • PEEK

Data Sheets and Specifications